November 3, 2013
Solderball Pin™ Technology from Autosplice - SMT Solution to Coplanarity Interconnection
for Power Modules and PCB- based Subassemblies
Solderball Pin™ Technology employs a highly conductive copper pin that incorporates a solder ball on the end that interfaces to the host PCB, providing additional solder to compensate for the coplanarity variation on the SMT board to board interconnection.
Now in stock at KENSINGTON ELECTRONICS!
FEATURES AND BENEFITS:
- Automatic coplanarity compensation: 0.020"
- High current carrying capability: 20A DC
- Converts through hole device into SMT
- Conducts heat from device to Host PCB
Call your Kensington sales representative today for Autosplice's Midi and Mini through hole and surface mount options, or send us an EMAIL.
Click HERE to request your free solderball sample kit!
To download the product brochure, click HERE.
To download the whitepaper on solderball pins, click HERE.