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Smiths Interconnect's KVPX Series

Resistant to Shock & Vibration - High Speed up to 16 Gbps - Faceplate to Protect Daughtercard Pins

Smiths Interconnect's KVPX Series is an embedded interconnect system that provides unrivaled performance in harsh environments while adapting to the VITA standard design requirements. By utilizing the Hypertac® superior hyperboloid contact technology, the KVPX Series ensures exceptional tolerance to shock and vibration, low insertion forces, high current ratings and the lowest fretting corrosion available.

Features & Benefits:

1. The waferized daughter-card assembly also provides single-ended and power wafer options. The backplane modules are available in 8 and 16 row increments on a 1.8mm x 1.8mm grid, with user-configurable keying and integrated stainless steel guide pin/keys.
2. The KVPX connector platform offers the ability to scale from 80 Mbps to over 10 Gbps while retaining the same Vita 46 backplane slot pitch at 20.3mm to 25.4mm. KVPX backplane connectors utilize 0.4mm Hypertac hyperboloid space qualified sockets, known to provide immunity to shock and vibration fretting, numerous linear paths of contact, low-forces, high mating cycles, and a self-wiping cleaning action that results in consistently better integrity in extreme environments.The KVPX daughtercard connectors incorporate a front face plate which prevents damage to the male contacts in an unmated condition.
3. KVPX is best suited and positioned for data intensive applications where high throughput and high computes are the critical factors. Intelligence, Surveillance & Reconnaissance (ISR), Signals Intelligence (SIGINT), radar applications and Electronic Counter Measures (ECM).

• High Speed up to 16 Gbps
• Compatible with VITA 46, 47 and 78 (Space) standards
• Flexible modular design for standard 3U and 6U as well as custom configurations
• Faceplate to protect daughtercard pins; press-fit termination

Click HERE to download Smiths Interconnect's KVPX Series brochure.

To contact our Sales Department for more information, please click HERE.